[1]卢 帅,郭 昭,齐海东,等.硫脲对Sn?Ni合金电沉积行为的影响[J].电镀与精饰,2019,(1):22-26.[doi:10.3969/j.issn.1001-3849.2019.01.005]
 LU Shuai,GUO Zhao,QI Haidong,et al.Effect of Thiourea on the Electrodeposition Behavior of Sn?Ni Alloy[J].Plating & Finishing,2019,(1):22-26.[doi:10.3969/j.issn.1001-3849.2019.01.005]
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硫脲对Sn?Ni合金电沉积行为的影响

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备注/Memo

收稿日期: 2018-08-28
修回日期: 2018-08-30
基金项目: 基金项目:国家自然科学基金资助项目(51774142)

更新日期/Last Update: 2019-01-16